AAI Awarded NSF TECP Grant for Commercialization Dry Adhesive Products with Velcro Companies

With the support of an NSF Technology Enhancement for Commercial Partnerships (TECP) grant, AAI has partnered with Velcro Companies, to develop the technology into products for a range of adhesive markets.  “It is a great opportunity to partner with a company that knows the industry and can help us expand and market our product,” said Dr. Barry Rosenbaum, AAI’s President and CEO.

The TECP grant is a supplement to the NSF Small Business Innovation Research (SBIR) grant received by AAI in March 2015 for electrospinning nanofibers for dry adhesive applications.  AAI has previously received grants from the NSF SBIR Phase 1 and Phase 2 programs, and received state support from the Ohio Third Frontier’s Technology Validation and Startup Fund (TVSF) Phase 1 and 2.  The award, which has a limit of $150,000, is intended to accelerate commercialization of dry adhesive products.  AAI has hired two new professional and one student intern with the fund, and expanded laboratory and testing capabilities.

For detailed information and highlights about NSF support for research at universities and small businesses in the state of Ohio, access the SEE Innovation website on Research.gov.