AAI CTO Prof. Wong gives invited lecture at Adhesives and Sealant Council Spring Convention

Akron Ascent Innovations Chief Technology Officer and co-founder Professor Shing-Chung (Josh) Wong will give an invited lecture at the Adhesives and Sealants Council Spring Convention on April 30, 2014.  The lecture will provide an overview of how a highly spinnable, high Tg polymer can be blended with a low Tg component in a heterogeneous morphology by electrospinning to create a polymer blend with marked increase in adhesive strength.